Huawei publishes patent related to ultrasonic fingerprint

Huawei has now listed an “ultrasonic fingerprint” patent. According to the document, the patent number is CN117058725A, and the application date is July 4, 2023.

The patent summary shows that this is “an ultrasonic fingerprint recognition module, system and electronic device”, which is claimed to “can improve the accuracy of identifying fingerprint information”. This new “ultrasonic fingerprint” patent announced by Huawei is expected to create a new type of ultrasonic fingerprint recognition solution.

Here’s the summary,

Embodiments of the present application provide an ultrasonic fingerprint identification module, system and electronic device.

Among them, an ultrasonic fingerprint recognition module includes: a stacked common electrode, a piezoelectric layer and a circuit substrate. The side of the circuit substrate close to the piezoelectric layer includes a plurality of pixel electrode units arranged in an array. Each pixel electrode unit Corresponding to one pixel, each pixel electrode unit includes N first pixel electrodes and M second pixel electrodes; one side of the piezoelectric layer is electrically connected to the common electrode, and the other side of the piezoelectric layer is connected to multiple pixel electrodes. The units are electrically connected; when the ultrasonic fingerprint recognition module is in the transmitting mode, the N first pixel electrodes are in a connected state, and the M second pixel electrodes are in a floating state; when the ultrasonic fingerprint recognition module is in the receiving mode , the N first pixel electrodes and the M second pixel electrodes are all connected.

Implementing the embodiments of the present application can improve the accuracy of identifying fingerprint information.